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多層陶瓷線路板晶體座
材料氧化鋁Alumina PCB (96% AI2O3)或氮化鋁Aluminum Nitride (AlN) PCB
薄膜工藝,燒結(jié)金屬可根據(jù)客戶要求
?HD Alumina with Thin Film
?Pt Co-Fire
?>99.5% Alumina (Injection Molding)
?Zirconia Toughened Alumina (Injection Molding)
?Beryllium Oxide (BeO)
Custom materials can be developed to meet special needs.
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汽車領(lǐng)域DPC陶瓷基板 (DPC Ceramic Board)
層數(shù):2層
板厚:1.0+/-0.1mm
所用板材:96%氧化鋁
最小孔徑:2.0mm
表面處理:沉金
絕緣層導(dǎo)熱系數(shù):50W
外層銅厚:35um
金 厚:>=3u"
工藝特點(diǎn):通孔、陶瓷基